Job Description: Principal Duties & Responsibilities no standard job description text
The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department,
and will be able to provide PWB design solutions for a variety of new 5G complex designs across multiple
business units (Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).
For example:
Product Test Engineering (PTE) designs - (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards
and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites up to 32X.
Emulator designs - large/high density digital designs having high layer counts (24-34 layers) and containing several
FPGA's (> 1500 pins) along with very high-speed digital signals.
Reference Mobile & Compute designs - 'form factor accurate' (FFA) test platform high volume circuit boards. These boards require mastery in digital
processors, RF and radio circuits as well as power control devices. Experience with micro-vias (stacked),
sequential lamination stack-ups and design rules using .5mm pitch and smaller packages.
Responsibilities:
Include working with US and India teams to provide PWB design solutions for high performance electronic
assemblies for Mobile, Modem and IOT. Specific tasks include daily use of PWB CAD design software to
perform placement and routing activities to meet mechanical and electrical design constraints and requirements.
Exchange of electronic file transfers to/from mechanical and electrical engineers to ensure compliance to fit,
form and function as well as power and signal integrity requirements. Creating fabrication and assembly
drawings and working with internal teams and external suppliers to support PWB fabrication and assembly. The
candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects.
Leadership skills are expected for managing the activities and performance of several PWB designers and
outside consultants. Also to provide project leadership for scoping requirements, staffing efforts, schedules, and
to ensure successful completion of quality board layouts.
The candidate is expected to have proficiency on Siemens/Mentor Xpedition, PADS and/or Cadence Allegro PWB
design software and is expected to have multiple years of experience in developing PWB design solutions for a
variety of design types and working with internal teams and external suppliers to support PWB fabrication and
assembly.
Minimum Qualifications
12+ years actively involved in PWB design for high-density electronics packaging.
3+ years experience in a PWB design role designing consumer-grade mobile products utilizing
latest generation processor chips.
Preferred Qualifications
Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
Design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, HDMI, PCIe, SATA,
MIPI, USB 2,3.x, GigE, ATE Platforms: 93K, uFlex and iFlex.
Expected to possess expert understanding and demonstrated application of PWB design principles,
practices and standards.
Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of
fabrication and assembly process capabilities and limitations.
Develops solutions to a variety of complex problems and proposes PWB design trade-offs to the
engineering design team for resolution and implementation.
Determine PWB design trade-offs necessary to meet design requirements and produce high quality
cost effective PWBs that meet schedule objectives.
Understands the requirements driving PWB technology and process trends and their application to
Qualcomm designs.
Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues
with fabrication and assembly vendors.
Participate and provide input into process improvement, PWB and DFM checklists and guidelines.
Participates in determining objectives of assignment and plans, schedules and arranges own
activities in accomplishing objectives.
Experience working with on-board EMI shielding cans.
Experience with IDF/EMN file exchange between mechanical and HW teams.
Understands project goals and individual contribution toward those goals.
Effectively communicates with project peers and engineering personnel via e-mail, web meetings,
and instant messaging including status reports and illustrative presentation slides.
Interact and collaborate with other internal PWB designers for optimal product development
processes and schedule execution.
Effectively multitasks and meets aggressive schedules in a dynamic environment.
Prepare and deliver design reviews to project team.
Possess excellent verbal and written communication skills
Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate
milestones and directions to outside team members.
Physical Requirements
Monitors and utilizes computers for more than 6 hours a day.
Continuous communication which includes the comprehension of information with colleagues,
customers, and vendors both in person and remotely.
Education
Associates Degree in a Technical Field, Electronics preferred
Comments for Suppliers: Hybrid - Onsite 2 days/week. Must be local
Goal is to convert within 6-12 months
Schedule 8am - 5pm, can be flexible
Supplier Call Notes:
12 years of experience, broad design skills, experience with all the design types listed in JD
Boulder Office, must be local
Fast paced production environment
Designs are very complex.
Ideally looking for a self-starter, strong work ethic, able to work well with others, strong communications skills
May work with India team on a shared design
Onsite initially while getting established and then hybrid
Dont want engineers, prefer AA or AS. •
Last updated on May 6, 2022