Head of „Advanced Packaging & Chiplet Solutions“ (m/f/d)

The Fraunhofer-Gesellschaft (www.fraunhofer.de) currently operates 76 institutes and research facilities in Germany and is the world's leading organization for application-oriented research. Around 30,000 employees generate the annual research volume of 2.9 billion euros.  
 
Adaptivity is an indispensable characteristic for the networked world of tomorrow. Intelligent components can detect and evaluate changes in the environment or in the system itself and adapt to them independently. As a partner of industry, Fraunhofer IIS/EAS develops key technologies for adaptive systems with about 110 employees at the Dresden site and offers innovative technologies and robust solutions. 
 
Do you want to actively shape the future of microelectronics and develop industry-ready chiplet systems with your interdisciplinary team?
 
Then we are the right place for you!
 
What you do with us

• You will lead our competence area for the development of flexible, modular and scalable electronic systems.
• You develop new architecture concepts and design methods for heterogeneous system integration and implement them in practice.
• You lead a scientific team and plan the strategic development of the competence field. You build networks with customers and cooperation partners and position the competence field in national and international committees.
• You support the development of service offerings, the acquisition of industrial contract research and the initiation of research projects.

 
What you bring with you

• Completed scientific university studies in engineering or natural sciences, technical computer science, mathematics or a comparable qualification
• Several years of experience in chip design, electronic design automation or advanced packaging with a focus on design
• In-depth knowledge of electronics development and the ecosystem relevant to it
• Knowledge of project management and experience in leading R&D projects
• Interpersonal skills, strong communication skills and enjoys contributing to the success of the team, teamleading and development
• Ideally, experience in acquiring industrial contract research and public research projects as well as knowledge of national and international research programs
• Industry knowledge e.g. in automotive electronics or automation technology is an advantage

What you can expect

• Attractive working environment in a highly innovative key industry
• Working in a competent and committed management team
• Regular training tailored to your individual needs and a state-of-the-art research infrastructure
• A corporate culture characterized by collegiality and appreciation
• Work-life balance through flexible working hours and a variety of support services to help you balance your private and professional life

 
Employment, compensation and benefits are based on the collective bargaining agreement for the public sector (TVöD). In addition, Fraunhofer may grant performance- and success-based variable compensation components.
 
The weekly working time is 39 hours. The position can also be filled part-time. The position is initially limited to three years.
 
Severely disabled persons will be given preference in the event of equal suitability.
We would like to point out that the chosen job title also includes the third gender.
The Fraunhofer-Gesellschaft attaches great importance to professional equality irrespective of gender.
 
Fraunhofer is the largest organization for application-oriented research in Europe. Our research fields are geared to people's needs: Health, Security, Communication, Mobility, Energy and Environment. We are creative, we shape technology, we design products, we improve processes, we open up new paths.

Interested?

Then apply online now with your application documents (PDF: cover letter, resume, references).

We look forward to getting to know you! 

Do you have any questions? Then contact: personal@eas.iis.fraunhofer.de.

Fraunhofer Institute for Integrated Circuits IIS 
www.iis.fraunhofer.de 

Reference number: 68818   Application deadline: none

Last updated on Nov 9, 2023