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TPV Module Process Engineer

gnjdnw4p7dcsh8maybnicg1a02iav20910i4tq2giw4936vpiu8xi6grvip5n9mz · 30+ days ago

Sunnyvale, CA, US

$135k+

Full-time

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PEAK is looking for a TPV Module Process Engineer for a client in Bay Area, CA.

ROLES & RESPONSIBILITIES:

Contribute to TPV Module Development : Play a key role in the development of TPV modules capable of efficiently handling both electrical and thermal power, with a strong focus on durability under thermal cycling.
Assembly Process Optimization : Explore and evaluate various assembly process options and collaborate closely with design engineers to communicate findings and recommendations.
In-House Capabilities Development : Establish in-house capabilities and forge local partnerships for critical processes, including wafer handling, frame-mounting, dicing, die-bonding, screen-printing, and inspection utilizing coordinate-measuring machines (CMM).
Process Control : Develop comprehensive procedures and documentation for process control and optimization to ensure consistency and reliability in TPV module manufacturing.
Quality Assessment: Assess the quality of die attach through methods such as x-ray analysis and scanning-acoustic microscopy, differential scanning calorimetry, thermal resistance, electrical resistance, pull strength testing and thermal cycling.
Materials Management: Procure and maintain an inventory of materials required for all module assembly processes.

QUALIFICATIONS:

Bachelor's degree in an engineering or technical field (e.g., mechanical engineering, electrical engineering, materials science, etc.), or equivalent.
2+ years of hands-on experience working with the assembly and/or packaging of semiconductor devices, including experience with processes such as frame-mounting, dicing, die-bonding, screen-printing, vacuum lamination and inspection utilizing coordinate-measuring machines (CMM).
Exceptional attention to detail with strong verbal and written communication skills.
Proficiency in modern software tools, including intra-office communication software and computer-aided design (CAD).

DESIRED:

Graduate degree in an engineering or technical field, or equivalent.
Direct experience with packaging large-area, high-power-density device arrays for applications in integrated circuits, power converters, and power electronics.
2+ years of direct experience in the development, prototyping, and testing of optoelectronic devices.
Experience with the assembly of photovoltaic (PV), concentrator photovoltaic (CPV), and/or thermophotovoltaic (TPV) modules.
Knowledge of Quality Assurance principles and practices.
Hands-on experience with wafer handling, frame-mounting, dicing, pick & place, die-bonding, and screen-printing processes.

Salary Range: $115,000 USD - $135,000 USD

•

Last updated on Sep 20, 2023

About the company

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