Job Description: Principal Duties & Responsibilities
The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to design and document printed wiring board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. Working in close coordination with electrical and mechanical design teams from supplied schematics and electrical and mechanical design constraints to develop PWB layouts that meet all project goals and requirements for a variety of new 5G designs across multiple business units (R&D, Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).
For example: Product Test Engineering (PTE) designs - (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites.
Reference Mobile, Infrastructure, IOT & Compute designs - 'form factor accurate' (FFA) test platform high volume circuit boards. These boards require mastery in digital processors, RF, and radio circuits as well as power control devices. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages. Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem and IOT.
The candidate is expected to have proficiency on Siemens/Mentor Xpedition, PADS or Cadence Allegro PWB design software and is expected to have experience in developing PWB design solutions for a variety of design types and working with internal teams and external suppliers to support PWB fabrication and assembly.
Minimum Qualifications
5+ years actively involved in PWB design for high-density electronics packaging.
3+ years experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.
Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
Preferred Qualifications
Design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, ATE Platforms: 93K, uFlex and iFlex.
Expected to possess expert understanding and demonstrated application of PWB design principles, practices, and standards.
Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
Develops solutions to a variety of complex problems and proposes PWB design trade-offs to the engineering design team for resolution and implementation.
Determine PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PWBs that meet schedule objectives.
Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.
Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues with fabrication and assembly vendors.
Participate and provide input into process improvement, PWB and DFM checklists and guidelines.
Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.
Experience working with various EMI mitigation techniques and practices.
Experience with IDF/EMN file exchange between mechanical and HW teams.
Understands project goals and individual contribution toward those goals.
Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.
Effectively multitasks and meets aggressive schedules in a dynamic environment.
Prepare and deliver design reviews to project team.
Possess excellent verbal and written communication skills
Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.
Education
Associates Degree in a Technical Field, Electronics preferred
Comments for Suppliers: Hybrid - Onsite 2 days/week. Must be local
Goal is to convert within 6-12 months
Schedule 8am - 5pm, can be flexible •
Last updated on Mar 30, 2022